Electronic Packaging Materials & Heat Sink Materials
Electronic Packaging Materials & Heat Sink Materials Power electronics and circuits produce a lot of heat when they work. Heat sink materials help to eliminate chip heat, transferring it to other media and keeping the chip stable.Get more news about Electronic Packaging Silicon Aluminum Alloy ,you can vist our website! Molybdenum copper, tungsten copper, CMC and CPC materials, combined with low thermal expansion rate of molybdenum, tungsten and conductivity of copper heat, can effectively release the heat of electronic device and contributes to the cooling of IGBT module, RF power amplifier, LED chips and other products. They are thus applied as a metal substrate, thermal control and heat insulation components (heat sink materials) and the lead frame in large-scale integrated circuit and high power microwave devices. Advantage The composite material of Aluminum silicon carbide is the aluminum silicon carbide ceramic and matal compound and then into new materials, with all the ...